Rework Station Strong Penetration Suitable

Features:

Using independent research and development of infrared heating technology, with strong penetrating power, no heat flow, uniform heat, does not affect the characteristics of the surrounding tiny components, breaking the traditional hot air heating technology to avoid large-scale shortcomings thermal shock.
Suitable for de-soldering and rework of BGA SMD PLCC CSP LGA QFP and BGA balls.
Infrared uses the handle lamp body structure, the operation is more flexible, easy to control, suitable for flat components at any angle, especially BGA, SMD components desolating
This machine is equipped with a thermonuclear to ensure the safety of the disassembled equipment and safer use.
The light source is soft, not glaring, the heat source is concentrated and stable.
This machine can remove all 15mm-35mm flat components

Specifications:

Power supply voltage:
220AC/50HZ
Infrared lamp head power:
120W
Power consumption of the whole machine:
300W
Heating element:
infrared light
Temperature range:
50-450 degrees Celsius
Thermonuclear model:
K indexing
Size:
170*140*90mm
Gross weight:
3.2kg

GARANTÍA

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