Universal Bga Stencil For Mtk Msm Samsung Huawei Xiaomi Ipad
10 reviews

Feature:


These stencils can be heated by the hot air machine, it is easy and quickly for reballing the BGA IC.
Solve the trouble when computer maintenance engineers in the use of direct heating steel mesh. Durable in use.
High success rate of planting tin, the solder balls can be formed once when you are proficient.
Simple and convenient to use.
BGA Reballing Stencil only, other accessories demo in the picture is not included!

Specifications:


Material: Stainless Steel
Size: Standard Size

Package Includes:


4 x BGA Reballing Stencils

WARRANTY

We'll refund your money if the item hasn't been delivered within 40 days after purchase. You have 2 weeks to request a refund — until day 60.
Product doesn't match the description? Contact us within 30 days after you receive it!
In case of cancellation, money will be refunded to your account within 3 days.