Solder Tin Rosin Based Flux Paste Cream
10 reviews

FEATURES:

MECHANIC Advanced Paste Flux Soldering for mobile phone motherboard Repair. Electric Soldering Iron Welding Fluxes for phone circuit board repair.
High bond strength. PH value neutral, insulation is strong, welding surface smooth
IC and PCB for no corrosive.
Its boiling point is only slightly higher than the melting point of the solder.
For mobile phones, PC cards and other sophisticated electronic chip-level help welding.

SPECIFICATIONS:


Model: UV50
Particle Size: 1-10?m
Viscosity: 0.2PaS
Granularity: 0.22um
Applicable to PCB, BGA, SMD, PGA repair.
Feature: Tin Rosin-Based Flux Paste Cream
Usage: Welding for Motherboard PCB BGA PGA SMD

HOW TO USE:


Wipe the surface of the object before soldering.
Apply the paste flux to the solder joint.
Solder the tin to the solder joint with soldering iron.

WARRANTY

We'll refund your money if the item hasn't been delivered within 40 days after purchase. You have 2 weeks to request a refund — until day 60.
Product doesn't match the description? Contact us within 30 days after you receive it!
In case of cancellation, money will be refunded to your account within 3 days.